Hitachi Cable Asia Pacific (HCAP) Pte Ltd
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Application
Lead Frame
Plating Type
Partial Ni, Partial Ag, Full Ni, Ag Stripe on Partial Ni,
Ag Stripe on Full Ni
Features
-High accuracy pre-plating position
-Maximum 18 rows for mini mold package
-Wide range of copper alloys to suit customer needs
Plating Process
Types of Plating for Mini-transistor
1.
Ordering Information
a) Contact us at
mailto:sales@hitachicable.com.sg
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© Hitachi Cable Asia Pacific, Ltd. 2006-2009. All rights reserved.